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HAD8635
    發布時間: 2019-07-23 17:09    

HAD8635

連線式COBPCB平面式固晶機

(週期:240ms

適用於印刷錫膏後的COBPCB固晶。

 

一、機型特性

1.平面式印刷錫膏後的COBPCB自動固晶的最佳選擇;

2.固晶週期240ms/顆,每小時產量為15K、精准的自動化設備為企業提高生產效率、降低成本提供了有效保障,從而切實有效地提高了企業競爭力;

3. 精准的固晶位置及優良的一致性為後道工序提供了先天的保障,同時固晶位置精準確保LED的品質;

4.採用左進料和右出料的連線方式,方便流水線式生產。


6.線性電機驅動晶片搜尋平臺(X/Y)與固晶平臺(B/C);

7.採用真空漏晶檢測;

8.工控機控制設備運行,簡化了自動化設備的操作。

 

HAD8635

Wired COB, PCB Plane-type Die Bonder

Cycle: 240ms

It is compatible with the printed solder paste COB, PCB die bond

 

Product Features

1.      It is the best choice for the printed solder paste COB, PCB automatic die bond;

2.      The cycle of die bond is 300ms/ piece, 12K UPH, sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;

3.      Precise die bond location and excellent compatibility will guarantee the back-end processing; meanwhile, precise die bond location will also guarantee the high quality of LED products;

4.      The left loading and right unloading method made it convenient for line production;

5.      Linear motor is applied to drive bond head;

6.      Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);

7.      Vacuum die missing testing technology is adopted;

8.      IPC will control the operation of equipment, simplifying the operation of automation equipment.


二、規格參數

Specifications and Parameters

 

1.系統功能/System Function

4.吸晶擺臂機械手系統/Die Bonder’s Swing Arm-and-hand system

生產週期

/Production Cycle

240ms(取決於晶片尺寸及支架)(Depending On Die Size And Holder)

吸晶擺臂/Swing Arm of Die Bonder

180°可旋轉固晶(Rotatable Die Bond)

XY位置精度/Accuracy

±0.8mil(±0.02mm

吸晶壓力/Die Bond Pressure

可調20g250g(Adjustable)

晶片旋轉/Die Rotation

±2°

5.送料工作平臺/Loading Workbench

2.晶片XY工作臺/Die XY Workbench

行程範圍/Range of Stroke

支架長/Length200mm-550mm.

支架寬/Width100mm-420mm.

晶片尺寸/Die Dimensions

4mil×4mil-80mil×80mil
(0.1mm*0.1mm-2mm*2mm)

固晶範圍

/Range of Die Bond

210mm*550mm

最大晶片環尺寸/Max. Die Ring Size

6″(152mm)外徑(External Diameter)

XY解析度/XY Resolution

0.02mil0.5μm

最大晶片面積尺寸/Max. Die Area

4.7119mm)擴張後(Expanded)

6.所需設施/Facilities Needed

解析度/Resolution Ratio

0.04mil  (1μm)

電壓/頻率/Voltage/Frequency

220V AC±5%/50HZ

頂針Z高度行程/Thimble Z Height Stroke

80mil2mm

壓縮空氣/Compressed Air

0.5MPaMIN

額定功率/Rated Power

665W

3.圖像識別系統/Image Recognition System

耗氣量/Gas Consumption

5L/min

灰階度/Grey Scale

256級灰度(Level Grey)

7.體積及重量/Volume and Weight

解析度/Resolution

512×512圖元(Pixels)

xx/

Length x Width x Height

233×123×200cm

圖像識別精准度/Image Recognition Accuracy

±0.025mil@50mil觀測範圍(Observation Range)

重量/Weight

1220kg

 

 

 

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