0755-27502933 
|
|
|
|
|
|
|
公司理念:創新、高效、和諧、務實
PRODUCT  service
產品服務
 
產品分類
HAD826PW-M
    發布時間: 2019-07-23 17:09    



HAD826PW-M(三頭平面式高速固晶機)

(單頭週期:300ms


一、機型特性

1.  採用直驅電機驅動邦頭

2.  採用線性電機驅動搜尋晶片平臺(X/Y)與送料平臺(B/C

3.  採用可程式恒溫雙點膠系統;

4.  採用真空漏晶檢測;

5.  採用自動式上下料,減少換料時間;

6.  工控機控制設備運行,簡化了自動化設備的操作;

7.  精准的設備化設備為企業提高生產效率,降低成本提供了有效保障,從而切實有效地提高了企業競爭力;

8.  精准的固晶位置及優良的一致性為後道工序提供了先天的保障,同時固晶位置精準確保LED燈光斑的品質,良好焊接及漂亮光斑再加上優良晶片就構成了高品質LED產品。

 

HAD826PW-M

Triple-head Plane-type High-speed Die Bonder

Single Head Cycle: 300ms

It is compatible with flip-chip PCB.

 

Product Features

1.      Linear motor is applied to drive bond head;

2.      Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);

3.      Programmed control constant-temperature double adhesive dispensing system is also applied;

4.      Vacuum die missing testing technology is adopted;

5.      Automatic loading and unloading system is applied to saving the time of reloading;

6.      IPC will control the operation of equipment, simplifying the operation of automation equipment;

7.      Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;

8.      Precise die bond location and excellent compatibility will guarantee the back-end processing; meanwhile, precise die bond location will also guarantee the high quality of LED lamp spot; thus, high-quality LED products will be created with excellent welding, elegant light spot and choiceness dies.

 


二、規格參數

Specifications and Parameters

1.系統功能/System Function

4、吸晶擺臂機械手系統/

Die Bonder’s Swing Arm-and-hand system

生產週期/Production Cycle

300ms(取決於晶片尺寸及支架)(Depending On Die Size And Holder)

吸晶擺臂/Swing Arm of Die Bonder

130°可旋轉固晶(Rotatable Die Bond)

XY精度/Accuracy

±0.8mil(±0.02mm

吸晶壓力/Die Bond Pressure

可調20g250g(Adjustable)

晶片旋轉/Die Rotation

±3°

5.送料工作平臺/Loading Workbench

2.晶片XY工作臺/Die XY Workbench

行程範圍/Range of Stroke

260mm*200mm

晶片尺寸/Die Dimensions

3mil×3mil-80mil×80mil
(0.1mm*0.1mm-2mm*2mm)

XY解析度/XY Resolution

0.02mil0.5μm

6.適用支架尺寸/Suitable Holder’s Size

晶片最大角度修正/Max. Angle Correction

±30°

支架長度/Length

170-260mm

最大晶片環尺寸/Max. Die Ring Size

6″(152mm)外徑(External Diameter)

支架寬度/Width

80-200mm

最大晶片面積尺寸/Max. Die Area

4.7″(119mm)擴張後(Expanded)

7.所需設施/Facilities Needed

解析度/Resolution Ratio

0.04mil  (1μm)

電壓/頻率/Voltage/Frequency

220V AC±5%/50HZ

頂針Z高度行程/Thimble Z Height Stroke

80mil2mm

壓縮空氣/Compressed Air

0.5MPaMIN

額定功率/Rated Power

1819W

3.圖像識別系統/Image Recognition System

耗氣量/Gas Consumption

5L/min

灰階度/Grey Scale

256級灰度(Level Grey)

8.體積及重量/Volume and Weight

解析度/Resolution

656×492圖元(Pixels)

xx/

Length x Width x Height

332×125×210cm

圖像識別精准度/Image Recognition Accuracy

±0.025mil@50mil觀測範圍(Observation Range)

重量/Weight

2000kg

 

 


快速通道
聯系我們
產品服務
公司介紹
新聞資訊