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HAD308
    發布時間: 2019-07-23 17:09    


HAD308
(週期:
80ms

適用于普通貼片,COB, 二極體,三極管,倒裝支架等

一、機型特性

1.採用國際領先的雙固晶,雙點膠,雙晶片搜尋系統;

2.採用直驅電機驅動邦頭

3.採用線性電機驅動搜尋晶片平臺(X/Y)與送料平臺(B/C

4. 晶框採用自動角度修正系統;

5.採用可程式恒溫點膠系統;

6.採用真空漏晶檢測;

7.採用免裝料盒上料方式,具備吸紙功能(能夠剔除框架隔離紙),有效提高了生產效率;

8.工控機控制設備運行,簡化了自動化設備的操作;

9.精准的自動化設備為企業提高生產效率,降低成本提供了有效保障,從而切實有效地提高了企業競爭力;

10. 精准的固晶位置及優良的一致性為後道工序提供了先天的保障

 

HAD308

Plane-type High-speed Die Bonder

Cycle: 80ms

It is compatible with SMDCOB diodeaudionflip-chip etc.

 

Product Features

1.      International leading double die bond, double adhesive dispensing and double die searching system;

2.      Linear motor is applied to drive bond head;

3.      Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);

4.      Crystal frame automatic correction chip structure is also applied

5.      Programmed control constant-temperature adhesive dispensing system is also applied;

6.      Vacuum die missing testing technology is adopted;

7.      Loading by free-loading magazine with paper suction function (eliminate the frame release paper), to largely improve the production efficiency;

8.      IPC will control the operation of equipment, simplifying the operation of automation equipment;

9.      Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;

10.  Precise die bond location and excellent compatibility will guarantee the back-end processing.


二、規格參數

Specifications and Parameters

 

1.系統功能/System Function

4、吸晶擺臂機械手系統/Die Bonder’s Swing Arm-and-hand system

生產週期/Production Cycle

80ms(取決於晶片尺寸及支架)(Depending On Die Size And Holder)

吸晶擺臂/Swing Arm of Die Bonder

90°可旋轉固晶(Rotatable Die Bond)

XY位置精度/Accuracy

±1mil(±0.025mm

吸晶壓力/Die Bond Pressure

可調20g250g(Adjustable)

晶片旋轉/Die Rotation

±1°

5.送料工作平臺/Loading Workbench

2.晶片XY工作臺/Die XY Workbench

行程範圍/Range of Stroke

300mm*75mm

晶片尺寸/Die Dimensions

5mil×5mil-80mil×80mil
(0.13mm*0.13mm-2mm*2mm)

XY解析度/XY Resolution

0.02mil0.5μm

6.適用支架尺寸/Suitable Holder’s Size

晶片最大角度修正/Max. Angle Correction

±15°

支架長度/Length

145mm ~ 300mm

最大晶片環尺寸/Max. Die Ring Size

8″(210mm)外徑  鐵環(External Diameter) Iron Ring

支架寬度/Width

40mm~ 75mm

最大晶片面積尺寸/Max. Die Area

6.5″(165mm)擴張後(Expanded)

7.所需設施/Facilities Needed

解析度/Resolution Ratio

0.04mil  (1μm)

電壓/頻率/Voltage/Frequency

220V AC±5%/50HZ

頂針Z高度行程/Thimble Z Height Stroke

80mil2mm

壓縮空氣/Compressed Air

0.5MPaMIN

額定功率/Rated Power

950W

3.圖像識別系統/Image Recognition System

耗氣量/Gas Consumption

5L/min

灰階度/Grey Scale

256級灰度(Level Grey)

8.體積及重量/Volume and Weight

解析度/Resolution

656 x 492圖元(Pixels)

xx/Length x Width x Height

175 x125 x185cm

圖像識別精准度/Image Recognition Accuracy

±0.025mil@50mil觀測範圍(Observation Range)

重量/Weight

1470kg

 

 

 

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