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HAD810
    發布時間: 2019-07-23 17:09    



HAD810

(週期: 220ms

適用於IC類框架

一、機型特性

1.直線電機驅動的雙點膠系統;

2.高精度直線驅動固晶綁頭,音圈扭力環精確控制固晶壓力;

3.高精度搜尋晶片平臺,伺服電機驅動晶片角度矯正系統,配備自動擴膜系統;

4.採用點膠獨立控制系統,膠量控制更加精確;

5.採用真空漏晶檢測;

6.工控機控制設備運行,簡化了自動化設備的操作;

7.精准的自動化設備為企業提高生產效率,降低成本提供了有效保障,從而切實有效地提高了企業競爭力;

 

HAD810

Automatic Plane-type Die Bonder

Cycle: 220ms

It is compatible with IC frame

 

1.        Linear motor is applied to drive double adhesive dispensing bond head;

2.        High precision linear driving die bond tieback, voice coil torsion loop controls die bond pressure accurately;

3.        High-precision die platform searching, servo motor driving die angle correction system, equipped with automatic film expansion system;

4.        A separate dispensing control system is adopted to make a precisely control of dispensing amount;

5.        Vacuum die missing testing technology is adopted;

6.        IPC will control the operation of equipment, simplifying the operation of automation equipment;

7.        Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance your enterprise’s competitiveness.


二、規格參數

Specifications and Parameters

1.系統功能/System Function

4、吸晶擺臂機械手系統/

Die Bonder’s Swing Arm-and-hand system

生產週期/Production Cycle

220ms(取決於晶片與支架)(Depending On Die Size And Holder)

吸晶擺臂

/Die Bonder’s Swing Arm

150mm 直線電機往復固/linear motor reciprocate die bonding

XY位置精度/Accuracy

±0.6mil(±0.015mm

吸晶壓力

/Die Bond Pressure

可調20g—250g(Adjustable)

不作上視式檢查Accuracy (Up-look inspection)

±1mil(±0.025mm

5.適用支架尺寸/Suitable Holder’s Size

晶片旋轉/Die Rotation

±1°

2.晶片XY工作臺/Die XY Workbench

支架長度/Length

110mm ~ 280mm

晶片尺寸/Die Dimensions

5mil×5mil-100mil×100mil
(0.13mm*0.13mm-2.54mm*2.54mm)

小於12mil晶片需考慮膠杯沾膠

(Consider the glue disk dispensing way if the die is lesser than 12mil)

支架寬度/Width

25mm ~ 110mm

晶片最大角度修正/

Max. Angle Correction

360°

6.所需設施/Facilities Needed

適用晶片環尺寸/

Max. Die Ring Size

外徑(External Diameter):296mm   內徑(Inner Diameter)254mm

電壓/頻率/Voltage/Frequency

220V AC±5%/50HZ

最大晶片面積尺寸

/Max. Die Area

直徑205mm(擴張後)(Expanded)

壓縮空氣/Compressed Air

0.5MPaMIN

解析度/Resolution Ratio

0.04mil  (1μm)

額定功率/Rated Power

1820W

頂針Z高度行程/Thimble Z Height Stroke

80mil2mm

耗氣量/Gas Consumption

5L/min

適用鐵環/晶圓

Suitable Iron ring/ wafer

標配 10寸鐵環8寸晶圓/Standard Equipped with 10Iron Ring and 8Wafer

可相容 8寸鐵環6寸晶圓/Compatible with 8Iron Ring and 6Wafer

3.圖像識別系統/Image Recognition System

適用針筒規格

Suitable Barrel Spec.

標配10CC(可相容5CC3CC) /Standard Equipped with 10CC, (Compatible with 5CCand 3CC)

灰階度/Grey Scale

256級灰度(Level Grey)

7.體積及重量/Volume and Weight

解析度/Resolution

656×492圖元(Pixels)

xx/

Length x Width x Height

205×135×190cm

圖像識別精准度/Image Recognition Accuracy

±0.025mil@50mil觀測範圍(Observation Range)

重量/Weight

1800kg

 


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