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HAD205-PDCO
    發布時間: 2019-07-23 17:09    


HAD205-P
(週期:
60ms

適用於貼片光耦

一、機型特性

刷膠工藝對膠量一致性/焊層viod控制較點膠和沾膠有明顯的優越性

堅固厚重的機構/網板座的可微調整設計,保證平臺和網板的相對水準

資料處理能力:;

1,錫膏點位置/大小即時檢測表格顯示,位置/大小超出上下限報警停機

2,錫膏點位置/大小資料保存可追蹤查詢;

3,錫膏點位置/大小資料統計功能,如cpk

4,錫膏點位置/大小資料檢測結果生成mappingdie attaching使用。

 

HAD205-P

Screen Printing Machine

Cycle: 60ms

It is compatible with SMD optocoupler etc.

 

Product Features

To the consistency of the glue amount/ the controlling of weld layer void, the cementing possess obvious advantages over dispending and sticking way 

Sturdy and heavy mechanism/ micro-adjustable stencil seat to ensure the relative level of the platform and the stencil

 

Data processing capabilities:

1.      Real time detection table display of the solder paste mark position/ size, auto-shutdown alarming system if position/size exceeds the upper and lower limits;

2.      Solder paste mark position/ size data preservation for querying anytime;

3.      Solder paste mark position/ size data statistics function, such as cpk.;

4.      Solder paste mark position/ size data detection results generate mapping for die attaching.

  

二、規格參數

Specifications and Parameters

 

1.系統功能/System Function

生產週期/Production Cycle

60ms(取決於晶片尺寸及支架)(Depending On Die Size And Holder)

25-30s/ 1pcs 支架/holder

2.送料工作平臺/Loading Workbench

行程範圍/Range of Stroke

100mm*300mm

3.適用支架尺寸/Suitable Holder’s Size

支架長度/Length

150mm~ 300mm

支架寬度/Width

50mm~ 100mm

4.所需設施/Facilities Needed

電壓/頻率/Voltage/Frequency

220V AC±5%/50HZ

壓縮空氣/Compressed Air

0.5MPaMIN

額定功率/Rated Power

500W

耗氣量/Gas Consumption

5L/min

5.體積及重量/Volume and Weight

xx/Length x Width x Height

139×85×180cm

重量/Weight

800kg

6.圖像識別系統/Image Recognition System

灰階度/Grey Scale

256級灰度(Level Grey)

解析度/Resolution

656×492圖元(Pixels)

圖像識別精准度/Image Recognition Accuracy

±0.025mil@50mil觀測範圍(Observation Range)

 

 
HAD205-D


(週期:60ms

適用於印刷錫膏後的貼片光耦

一、機型特性

1.採用國際領先的雙固晶,雙晶片搜尋系統;

2.採用直驅電機驅動邦頭

3.採用線性電機驅動搜尋晶片平臺(X/Y)與送料平臺(B/C

4. 晶框採用自動角度修正系統;

5.採用真空漏晶檢測;

6. 採用自動式上下晶環、自動接駁台結構,有效提高了生產效率;

7. 工控機控制設備運行,簡化了自動化設備的操作;

8.精准的設備化設備為企業提高生產效率,降低成本提供了有效保障,從而切實有效地提高了企業競爭力;

9. 精准的固晶位置及優良的一致性為後道工序提供了先天的保障

 

HAD205-D

Plane-type High-speed Die Bonder

Cycle: 60ms

It is compatible with solder paste printed SMD optocoupler etc.

 

Product Features

1.      International leading double die bond and double die searching system;

2.      Linear motor is applied to drive bond head;

3.      Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);

4.      Automatic chip theta alignment system is applied on the Crystal frame;

5.      Vacuum die missing testing technology is adopted;

6.      Automatic up & down crystal rings and automatic inspection conveyor system is applied to improve the production efficiency largely;

7.      IPC will control the operation of equipment, simplifying the operation of automation equipment;

8.      Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;

9.      Precise die bond location and excellent compatibility will guarantee the back-end processing.

  

二、規格參數

Specifications and Parameters

1.系統功能/System Function

4、吸晶擺臂機械手系統/

Die Bonder’s Swing Arm-and-hand system

生產週期/Production Cycle

60ms(取決於晶片尺寸及支架)(Depending On Die Size And Holder)

吸晶擺臂/

Swing Arm of Die Bonder

雙擺臂126°可旋轉固晶(Rotatable Die Bond with Double Swing Arms)

XY位置精度/Accuracy (帶晶片校正功能/ With Die Correcting Feature)

±1mil(±0.025mm

吸晶壓力/

Die Bond Pressure

可調20g250g(Adjustable)

晶片旋轉/Die Rotation

±1°

5.送料工作平臺/Loading Workbench

2.晶片XY工作臺/Die XY Workbench

行程範圍/

Range of Stroke

100mm*300mm

晶片尺寸/

Die Dimensions

5mil×5mil-80mil×80mil
(0.13mm*0.13mm-2.0mm*2.0mm)

XY解析度/

XY Resolution

0.02mil0.5μm

6.適用支架尺寸/Suitable Holder’s Size

晶片最大角度修正/Max. Angle Correction

360°

支架長度/Length

150mm ~ 300mm

最大晶片環尺寸/

Max. Die Ring Size

6″與7″可選(Optional)

支架寬度/Width

50mm~ 100mm

最大晶片面積尺寸/Max. Die Area

4″(101mm)、5″(127mm

7.所需設施/Facilities Needed

解析度/

Resolution Ratio

0.04mil  (1μm)

電壓/頻率/Voltage/Frequency

220V AC±5%/50HZ

頂針Z高度行程/Thimble Z Height Stroke

80mil2mm

壓縮空氣/

Compressed Air

0.5MPaMIN

額定功率/Rated Power

1000W

3.圖像識別系統/Image Recognition System

耗氣量/

Gas Consumption

5L/min

灰階度/Grey Scale

256級灰度(Level Grey)

8.體積及重量/Volume and Weight

解析度/Resolution

656×492圖元(Pixels)

xx/

Length x Width x Height

192×85×180cm

圖像識別精准度/Image Recognition Accuracy

±0.025mil@50mil觀測範圍(Observation Range)

重量/Weight

1250kg

 


HAD205-C


(週期:60ms

適用於印刷錫膏後的貼片光耦

一、機型特性

1Die dispensing

穩固的機構設計;點膠模組可擴展性適應客戶支架;高達4組點膠針頭,大大提高了點膠效率,每組點膠機構X/Y/Z向可調整方便調試維護;

2Clip attaching

高精密度沖切模具可保證切口毛刺小於0.05mm;刀具壽命可達2kk次;clip bond force參數化設定可保證晶片不受損

資料處理能力:

a,點膠點和Clip安裝點位置/大小即時檢測表格顯示,位置/大小超出上下限報警停機

b,點膠點和Clip安裝點位置/大小資料保存可追蹤查詢

c,點膠點和Clip安裝點位置/大小資料統計功能,如cpk

d,點膠點和Clip安裝點位置/大小資料檢測結果生成mappingdie attaching使用

 

HAD205-C

Clip and Cutting Machine

Cycle: 60ms

It is compatible with solder paste printed SMD optocoupler etc.

 

Product Features

1.      Die Dispensing

Stable mechanism design; Dispensing module can adapt to your holder; there are up to 4 sets of dispensing needles, which improved the dispensing efficiency greatly, each group of dispensing mechanism X / Y / Z direction are adjustable which facilitates debugging and maintenance;

2, Clip Attaching

The cutting burr is less than 0.05mm with the high-precision die-cutting mold; the tool life can reach to 2kk times; the clip bond force parameterization can protect the chip from damage.

Data processing capabilities:

a, Real time detection table display of the dispensing mark and clip mounting mark position/ size, auto-shutdown alarming system if position/size exceeds the upper or lower limits;

b, Dispensing mark and clip mounting mark position/ size data preservation for querying anytime;

c, Dispensing mark and clip mounting mark position/ size data statistics function, such as cpk.;

d, Dispensing mark and clip mounting mark position/ size data detection results generate mapping for die attaching.

 

二、規格參數

Specifications and Parameters

1.系統功能/System Function

生產週期/Production Cycle

60ms(取決於晶片尺寸及支架)(Depending On Die Size And Holder)

2.送料工作平臺/Loading Workbench

行程範圍/Range of Stroke

100mm*300mm

3.適用支架尺寸/Suitable Holder’s Size

支架長度/Length

150mm ~ 300mm

支架寬度/Width

50mm~ 100mm

4.所需設施/Facilities Needed

電壓/頻率/Voltage/Frequency

220V AC±5%/50HZ

壓縮空氣/Compressed Air

0.5MPaMIN

額定功率/Rated Power

1000W

耗氣量/Gas Consumption

5L/min

5.體積及重量/Volume and Weight

xx/Length x Width x Height

150×95×180cm

重量/Weight

1000kg

6.圖像識別系統/Image Recognition System

灰階度/Grey Scale

256級灰度(Level Grey)

解析度/Resolution

656×492圖元(Pixels)

圖像識別精准度/Image Recognition Accuracy

±0.025mil@50mil觀測範圍(Observation Range)

 

 

HAD205-O


(週期:60ms

適用於印刷錫膏後的貼片光耦

一、機型特性

1.產能 = 10~30 Sec. / 每一片(按錫膏商建議的Profile)

2.低耗電(升溫時26KW/保溫時2KW);低耗氣(100/)

3.無氧化焊接 (氮氣或氮氫混合氣),含氧量20ppm以下

4.同一溫區 溫差小於5˚C

5.可程式化之溫度曲線設定

6.即時溫度監控

7.不卡料之料片傳送機構

二、優越性:

1.油煙處理 : 靜電式油煙收集方式,回流焊接時產生之廢氣經處理後可直排室內

2.爐內腔體清潔保養週期 : 依錫膏品質/成份不同而異,如indium免清洗錫膏可一周清潔一次爐內腔體

3.自動profile功能:系統可自動產生爐溫曲線,並可保存查詢

4.爐蓋加熱:爐蓋備有加熱功能,保證焊油不在爐蓋上凝聚

5.加熱棒:選用高品質加熱棒,保證同一溫區各點實測最高溫減最低溫小於或等於5

 

HAD205-O

Reflow Oven

Cycle: 60ms

It is compatible with solder paste printed SMD optocoupler etc.

 

Product Features

1. Capacity is 10~30 Sec. per piece (as recommended Profile by solder paste)

2. Low power consumption (26KW when warming up/2KW when keep warming); low gas consumption (100 liters/min)

3. No oxidation welding (nitrogen or nitrogen-hydrogen mixture), oxygen content below 20ppm

4. The temperature difference is less than 5 ̊C in the same temperature zone

5. Programmable temperature curve setting

6. Instant temperature monitoring

7. Unloaded web transfer mechanism

Superiority

1. Lampblack treatment: Electrostatic lampblack collection, the exhaust gas generated during reflow soldering can be directly discharged indoors after being treated;

2. The cycle of furnace cavity cleaning and maintenance: Depending on the quality/component of the solder paste, such as indium no-clean solder paste which needs to clean the inner cavity once a week;

3. Automatic profile function: the system can generate the furnace temperature curve automatically and preserve the data for querying anytime;

4. Furnace cover heating: The furnace cover is equipped with heating function to preserve the welding oil from condense on the furnace cover.

5. Heating rod: the high-quality heating rod is adopted which can ensure that the actual measurement of the highest temperature minus the lowest temperature in each temperature zone is less than or equal to 5.


三、規格參數:

Specifications and Parameters

 

1.系統功能/System Function

生產週期/Production Cycle

60ms(取決於晶片尺寸及支架)(Depending On Die Size And Holder)

2.送料工作平臺/Loading Workbench

行程範圍/Range of Stroke

100mm*300mm

3.適用支架尺寸/Suitable Holder’s Size

支架長度/Length

150mm ~ 300mm

支架寬度/Width

50mm~ 100mm

4.所需設施/Facilities Needed

電壓/頻率/Voltage/Frequency

380V AC±5%/50HZ

壓縮空氣/Compressed Air

0.5MPaMIN

額定功率/Rated Power

32000W

耗氣量/Gas Consumption

5L/min

5.體積及重量/Volume and Weight

xx/Length x Width x Height

210×120×150cm

重量/Weight

1200kg

6.溫度/Temperature

範圍/Range

0400

7.水流量及水溫/Water Flow and Temperature

水流量/Water Flow

5L / Min

水溫/Water Temperature

15~20˚C

8.適用氣體 Suitable Gas

N2/H2=93%/7% or N2 only

 

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