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HAD300A-R, HAD300A-L
    Publish time 2019-07-18 16:08    

HAD300A-R, HAD300A-L

Triple-head Plane-type High-speed Die Bonder

Single Head Cycle: 170ms

It is compatible with SMD0201010 212130142835 and 5050 etc.

 

Product Features

1.      International leading triple die bond, triple adhesive dispensing and triple die searching system;

2.      Linear motor is applied to drive bond head;

3.      Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);

4.      Programmed control constant-temperature double adhesive dispensing system is also applied;

5.      Vacuum die missing testing technology is adopted;

6.      Automatic loading and unloading system is applied to saving the time of reloading;

7.      IPC will control the operation of equipment, simplifying the operation of automation equipment;

8.      Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;

9.      Precise die bond location and excellent compatibility will guarantee the back-end processing; meanwhile, precise die bond location will also guarantee the high quality of LED lamp spot; thus, high-quality LED products will be created with excellent welding, elegant light spot and choiceness dies;

10.  GS300A-R is right loading and left unloading, the GS300A-L is left loading and right unloading.

Specifications and Parameters

1.系统功能/System Function

4、吸晶摆臂机械手系统/

Die Bonder’s Swing Arm-and-hand system

生产周期/Production Cycle

170ms(取决于晶片尺寸及支架(Depending On Die Size And Holder)

吸晶摆臂/Swing Arm of Die Bonder

360°可旋转固晶 (Rotatable Die Bond)

XY位置精度/Accuracy

±1.0mil(±0.025mm

吸晶压力/Die Bond Pressure

可调20g250g(Adjustable)

芯片旋转/Die Rotation

±3°

5.送料工作平台/Loading Workbench

2.芯片XY工作台/Die XY Workbench

行程范围/Range of Stroke

170mm*75mm

芯片尺寸/Die Dimensions

5mil×5mil-80mil×80mil
(0.13mm*0.13mm-2mm*2mm)

XY分辨率/XY Resolution

0.02mil0.5μm

6.适用支架尺寸/Suitable Holder’s Size

晶片最大角度修正/Max. Angle Correction

 ±30°

支架长度/Length

80-170mm

最大芯片环尺寸/Max. Die Ring Size

6″(152mm)外径(External Diameter)

支架宽度/Width

45-75mm

最大芯片面积尺寸/Max. Die Area

4.7″(119mm)扩张后(Expanded)

7.所需设施/Facilities Needed

分辨率/Resolution Ratio

0.04mil  (1μm)

电压/频率/Voltage/Frequency

220V AC±5%/50HZ

顶针Z高度行程/Thimble Z Height Stroke

80mil2mm

压缩空气/Compressed Air

0.5MPaMIN

额定功率/Rated Power

1300W

3.图像识别系统/Image Recognition System

耗气量/Gas Consumption

5L/min

灰阶度/Grey Scale

256级灰度(Level Grey)

8.体积及重量/Volume and Weight

分辨率/Resolution

656×492像素(Pixels)

xx/Length x Width x Height

249×93×195cm

图像识别精准度/Image Recognition Accuracy

±0.025mil@50mil观测范围(Observation Range)

重量/Weight

1700kg

 

 

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